JPH0432762Y2 - - Google Patents
Info
- Publication number
- JPH0432762Y2 JPH0432762Y2 JP13689086U JP13689086U JPH0432762Y2 JP H0432762 Y2 JPH0432762 Y2 JP H0432762Y2 JP 13689086 U JP13689086 U JP 13689086U JP 13689086 U JP13689086 U JP 13689086U JP H0432762 Y2 JPH0432762 Y2 JP H0432762Y2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- film fixing
- film
- fixing member
- lead terminals
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 14
- 239000012212 insulator Substances 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Die Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Credit Cards Or The Like (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13689086U JPH0432762Y2 (en]) | 1986-09-04 | 1986-09-04 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13689086U JPH0432762Y2 (en]) | 1986-09-04 | 1986-09-04 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6343430U JPS6343430U (en]) | 1988-03-23 |
JPH0432762Y2 true JPH0432762Y2 (en]) | 1992-08-06 |
Family
ID=31040428
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13689086U Expired JPH0432762Y2 (en]) | 1986-09-04 | 1986-09-04 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0432762Y2 (en]) |
-
1986
- 1986-09-04 JP JP13689086U patent/JPH0432762Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS6343430U (en]) | 1988-03-23 |
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